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c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 7 - m a r . , 2 0 1 2 a p l 3 5 1 0 / 1 w w w . a n p e c . c o m . t w 1 a n p e c r e s e r v e s t h e r i g h t t o m a k e c h a n g e s t o i m p r o v e r e l i a b i l i t y o r m a n u f a c t u r a b i l i t y w i t h o u t n o t i c e , a n d a d v i s e c u s t o m e r s t o o b t a i n t h e l a t e s t v e r s i o n o f r e l e v a n t i n f o r m a t i o n t o v e r i f y b e f o r e p l a c i n g o r d e r s . u s b p o w e r - d i s t r i b u t i o n s w i t c h e s 70m w (msop-8) high side mosfet w i d e s u p p l y v o l t a g e r a n g e : 2 . 7 v t o 5 . 5 v current-limit and short-circuit protections over-temperature protection fault indication output enable input ul approved-file no. e328191 nemko iec 60950-1:2005(2nd edition)+am 1:2009 en 60950-1:2006+a11:2009+a1:2010+a12:2011 cb_scheme certified, no.67404 t u v i e c 6 0 9 5 0 - 1 : 2 0 0 5 + a 1 : 2 0 0 9 a n d e n 6 0 9 5 0 - 1 : 2 0 0 6 + a 1 1 : 2 0 0 9 + a 1 : 2 0 1 0 c e r t i f i e d , n o . 4 4 7 8 0 1 1 3 9 3 9 5 4 lead free and green devices available (rohs compliant) the apl3510/1 series of power switches are designed for usb applications. the 70m w n-channel mosfet power switch satisfies the voltage drop requirements of usb specification. f e a t u r e s g e n e r a l d e s c r i p t i o n a p p l i c a t i o n s notebook and desktop computers usb ports high-side power protection switchs p i n c o n f i g u r a t i o n s the protection features include current-limit protection, short-circuit protection, and over-temperature protection. the device limits the output current at current limit thresh- old level. when v out drops below v in -1v, the devices limit the current to a lower and safe level. the over-tempera- ture protection limits the junction temperature below 140 o c in case of short circuit or over load conditions. other features include a deglitched ocb output to indi- cate the fault condition and an enable input to enable or disable the device. s i m p l i f i e d a p p l i c a t i o n c i r c u i t vin 2 7 vout vin 3 enb 4 6 vout 5 ocb 8 vout gnd 1 sop-8/msop-8 apl3510b/d (top view) 6 vout 5 ocb gnd 1 vin 2 7 vout vin 3 en 4 8 vout sop-8/msop-8 apl3510a/c (top view) gnd 2 5 vin ocb 3 4 en vout 1 sot-23-5 apl3511a/c (top view) gnd 2 5 vin ocb 3 4 enb vout 1 sot-23-5 apl3511b/d (top view) gnd 2 5 vout en 3 4 vin ocb 1 sot-23-5 apl3510a/c/e (top view) sot-23-5 apl3510b/d/f (top view) gnd 2 5 vout enb 3 4 vin ocb 1 vin vout gnd apl3510a/b/c/d/e/f apl3511a/b/c/d ocb en/enb usb controller 5v usb port
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 7 - m a r . , 2 0 1 2 a p l 3 5 1 0 / 1 w w w . a n p e c . c o m . t w 2 o r d e r i n g a n d m a r k i n g i n f o r m a t i o n n o t e : a n p e c l e a d - f r e e p r o d u c t s c o n t a i n m o l d i n g c o m p o u n d s / d i e a t t a c h m a t e r i a l s a n d 1 0 0 % m a t t e t i n p l a t e t e r m i n a t i o n f i n i s h ; w h i c h a r e f u l l y c o m p l i a n t w i t h r o h s . a n p e c l e a d - f r e e p r o d u c t s m e e t o r e x c e e d t h e l e a d - f r e e r e q u i r e m e n t s o f i p c / j e d e c j - s t d - 0 2 0 d f o r m s l c l a s s i f i c a t i o n a t l e a d - f r e e p e a k r e f l o w t e m p e r a t u r e . a n p e c d e f i n e s ? g r e e n ? t o m e a n l e a d - f r e e ( r o h s c o m p l i a n t ) a n d h a l o g e n f r e e ( b r o r c l d o e s n o t e x c e e d 9 0 0 p p m b y w e i g h t i n h o m o g e n e o u s m a t e r i a l a n d t o t a l o f b r a n d c l d o e s n o t e x c e e d 1 5 0 0 p p m b y w e i g h t ) . a b s o l u t e m a x i m u m r a t i n g s ( n o t e 1 ) symbol parameter rating unit v in vin input voltage (vi n to gnd ) - 0.3 ~ 7 v v out vout to gnd voltage - 0.3 ~ 7 v v enb , v en en, enb to gnd voltage - 0.3 ~ 7 v v ocb ocb to gnd voltage - 0.3 ~ 7 v t j maximum junction temperature 150 o c t stg storage tempera ture - 65 ~ 150 o c t sdr maximum lead soldering temperature , 10 seconds 26 0 o c note1: stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom- mended operating conditions" is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. t h e r m a l c h a r a c t e r i s t i c s symbol parameter typical value unit q ja junction - to - ambient resistance in free air (note 2) sop - 8 msop - 8 sot - 23 - 5 160 160 235 o c/w note 2 : q ja is measured with the component mounted on a high effective thermal conductivity test board in free air. apl3510 apl3511 package code k : sop-8 x : msop-8 b : sot-23-5 operating ambient temperature range i : -40 to 85 o c handling code tr : tape & reel output current/en function a : 2a/active high b : 2a/active low c : 1a/active high d : 1a/active low e : 0.3a/active high f : 0.3a/active low assembly material g : halogen and lead free device handling code temperature range package code apl 3510a k: apl3510a xxxxx - date code assembly material xxxxx apl 3510a x: l 510 a xxxxx - date code xxx xx output current/en function apl 3510a b: l0ax x - date code apl 3511a b: l1ax x - date code
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 7 - m a r . , 2 0 1 2 a p l 3 5 1 0 / 1 w w w . a n p e c . c o m . t w 3 symbol parameter range unit v in vin input voltage 2.7 ~ 5.5 v out output current (apl3510a/b, apl3511a/b) 0 ~ 2 out output current (apl3510c/d, apl3511c/d) 0 ~ 1 i out out output current (apl3510e/f) 0 ~ 0.3 a t a ambient temperature - 40 ~ 85 o c t j ju nction temperature - 40 ~ 125 o c e l e c t r i c a l c h a r a c t e r i s t i c s unless otherwise specified, these specifications apply over v in =5v, v en =5v or v enb =0v and t a = -40 ~ 85 o c. typical values are at t a =25 o c. apl3 51 0 /1 symbol parameter test conditions min . typ . max . unit supply current no load, v en =0v or v enb =5v - - 1 m a vin supply current no load, v en =5v or v enb =0v - 65 100 m a leakage current vout=gnd, v en =0v or v enb =5v - - 1 m a reverse leakage current vin=gnd, v out =5v, v en =0v or v enb =5v - - 1 m a power switch sop - 8 package - 80 90 sot - 23 - 5 package - 75 90 r ds(on) power switch on resistance i out =1.5a, t a = 2 5 o c msop - 8 package - 70 90 m w under - voltage lockout (uvlo) vin uvlo thresh old voltage v in rising, t a = - 40 ~ 85 o c 1.7 - 2.65 v vin uvlo hysteresis - 0.2 - v current - limit and short - circuit protections i lim current limit threshold apl3510a/b, apl3511a/b, v in = 2.7 v to 5.5v, t a = - 40 ~ 85 o c 2.1 2.5 2.9 a apl3510c/d, apl3511 c/d, v in = 2.7 v to 5.5v, t a = - 40 ~ 85 o c 1.1 1.5 1.9 a apl3510e/f, v in = 2.7 v to 5.5v, t a = - 40 ~ 85 o c 0.35 - 0.7 a i short short - circuit output current apl3510a/b, apl3511a/b, v in = 2.7 v to 5.5v - 0.8 - a apl3510c/d, apl3511c/d, v in = 2.7 v to 5.5v - 0.8 - a apl3510e/f, v in = 2.7 v to 5.5v 0.35 - 0.7 a r e c o m m e n d e d o p e r a t i n g c o n d i t i o n s ( n o t e 3 ) note 3 : refer to the typical application circuit
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 7 - m a r . , 2 0 1 2 a p l 3 5 1 0 / 1 w w w . a n p e c . c o m . t w 4 e l e c t r i c a l c h a r a c t e r i s t i c s ( c o n t . ) unless otherwise specified, these specifications apply over v in =5v, v en =5v or v enb =0v and t a = -40 ~ 85 o c. typical values are at t a =25 o c. apl3 51 0 /1 symbol parameter test conditions min . typ . max . unit ocb output pin ocb output low voltage i ocb =5ma - 0.2 0.4 v ocb leakage current v ocb =5v - - 1 m a t d(ocb) ocb deglitch time ocb assertion, t a = - 40 ~ 85 o c 5 12 20 ms en or enb input p in v ih input logic high v in = 2.7 v to 5v 2 - - v v il input logic low v in = 2.7 v to 5v - - 0.8 v input current - - 1 m a vout discharge resistance v en =0v or v enb =5v - 150 - w t d(on) turn on delay time - 30 - m s t d(off) turn off delay time - 30 - m s t ss soft - start time no load, c out =1 m f, v in = 5 v - 400 - m s over - temperature protection (otp) t otp over - temperature threshold t j rising - 140 - c over - temperature hysteresis - 20 - c
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 7 - m a r . , 2 0 1 2 a p l 3 5 1 0 / 1 w w w . a n p e c . c o m . t w 5 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s current limit threshold vs. junction temperature c u r r e n t l i m i t t h r e s h o l d , i l i m ( a ) apl3510a/b apl3510c/d junction temperature ( o c) v in =5v 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 0 50 100 150 input voltage (v) c u r r e n t l i m i t t h r e s h o l d , i l i m ( a ) current limit threshold vs. input voltage apl3510a/b apl3510c/d t a =25 o c 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 2.5 3.0 3.5 4.0 4.5 5.0 5.5 switch on resistance vs. input voltage s w i t c h o n r e s i s t a n c e , r d s ( o n ) ( m w ) input voltage (v) sop8 msop8 sot-23-5 i out =1.5a, c in =1 m f/x7r, c out =10 m f/ x7r, t a =25 o c 60 80 90 100 110 120 130 70 50 2.5 3.0 3.5 4.0 4.5 5.0 5.5 supply current vs. input voltage input voltage (v) s u p p l y c u r r e n t , i c c ( m a ) 20 25 30 35 40 45 50 55 60 r load = open, c in =c out =33 m f/ electrolytic, t a j =25 2.5 3.0 3.5 4.0 4.5 5.0 5.5 supply current vs. junction temperature s u p p l y c u r r e n t , i c c ( m a ) junction temperature ( o c) v in =5v, r load = open, c in =c out =33 m f/ electrolytic -50 0 50 100 150 0 20 40 60 80 100 s w i t c h o n r e s i s t a n c e , r d s ( o n ) ( m w ) switch on resistance vs. junction temperature sop8 msop8 sot-23-5 v in =5v, i out =1.5a , c in =1 m f/x7r, c out =10 m f/x7r junction temperature ( o c) 40 60 80 100 120 140 160 20 0 -50 0 50 100 150
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 7 - m a r . , 2 0 1 2 a p l 3 5 1 0 / 1 w w w . a n p e c . c o m . t w 6 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s ( c o n t . ) short-circuit output current vs. input voltage input voltage (v) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 s h o r t - c i r c u i t o u t p u t c u r r e n t , i s h o r t ( a ) v in = 5v, t a =25 o c 2.5 3.0 3.5 4.0 4.5 5.0 5.5 current-limit response vs. output peak current output peak current (a) c u r r e n t - l i m i t r e s p o n s e ( m s ) 0 50 100 150 200 250 apl3510c/d, v in = 5v, t a =25 o c 0 2 4 6 8 10 12 0 50 100 150 200 250 300 0 2 4 6 8 10 12 output peak current (a) c u r r e n t - l i m i t r e s p o n s e ( m s ) current-limit response vs. output peak current apl3510a/b, v in = 5v, t a =25 o c en pin threshold voltage vs. junction temperature e n p i n t h r e s h o l d v o l t a g e , v e n ( v ) junction temperature ( o c) en rising en falling r load =50 w , c in = c out =33 m f/elctrolytic -50 0 50 100 150 0.5 1.0 1.5 2.0 2.5 3.0 turn-off leakage current vs. junction temperature t u r n - o f f l e a k a g e c u r r e n t , i l e a k ( m a ) junction temperature ( o c) v in =5v, shut-down mode, r load =0 w , c in = c out =33 m f/elctrolytic 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 -50 0 50 100 150 en pin threshold voltage vs. input voltage input voltage (v) e n p i n t h r e s h o l d v o l t a g e , v e n ( v ) en rising en falling v in =5v, r load =50 w , c in = c out =33 m f/elctrolytic, t a =25 o c 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 0.8 0.9 1.0 1.1 1.2 2.5 3.0 3.5 4.0 4.5 5.0 5.5
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 7 - m a r . , 2 0 1 2 a p l 3 5 1 0 / 1 w w w . a n p e c . c o m . t w 7 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s ( c o n t . ) uvlo threshold voltage vs. junction temperature u v l o t h r e s h o l d v o l t a g e , v u v l o ( v ) uvlo rising uvlo falling i out = 15m a , c in = c out =33 m f/elctrolytic junction temperature ( o c) 1.2 1.6 2.0 2.4 2.8 3.2 0.8 -50 0 50 100 150 switch off supply current vs. junction temperature s w i t c h o f f s u p p l y c u r r e n t , i c c ( o f f ) ( m a ) junction temperature ( o c) v in = 5v, r load = open, c in = c out =33 m f/elctrolytic 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 -50 0 50 100 150 ocb deglitch time vs. junction temperature o c b d e g l i t c h t i m e , t d ( o c b ) ( m s ) r load =1 w , c in = c out =33 m f/elctrolytic junction temperature ( o c) -50 0 50 100 150 9 10 11 12 13 14 15 16 17 18 ocb deglitch time vs. input voltage input voltage (v) o c b d e g l i t c h t i m e , t d ( o c b ) ( m s ) r load =1 w , c in = c out =33 m f/elctrolytic 2.5 3.0 3.5 4.0 4.5 5.0 5.5 9 10 11 12 13 14 15 16 17 18 t u r n - o n r i s i n g t i m e , t r ( m s ) turn-on rising time vs. junction temperature junction temperature ( o c) v in = 5v, r load =30 w , c in = 33 m f/elctrolytic, c out =1 m f/x7r -50 0 50 100 150 0 100 200 600 700 300 400 500 turn-off falling time vs. junction temperature t u r n - o f f f a l l i n g t i m e , t f ( m s ) v in = 5v, r load =30 w , c in = 33 m f/elctrolytic, c out =1 m f/x7r junction temperature ( o c) 100 150 200 50 0 -50 0 50 100 150
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 7 - m a r . , 2 0 1 2 a p l 3 5 1 0 / 1 w w w . a n p e c . c o m . t w 8 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s ( c o n t . ) o u t p u t v o l t a g e , v o u t ( v ) 0 1 2 3 4 5 6 output current (a) output voltage vs. output current apl3510c/d, v in = 5v, t a =25 o c 0.0 0.5 1.0 1.5 2.0 output voltage vs. output current 0 1 2 3 4 5 6 o u t p u t v o l t a g e , v o u t ( v ) output current (a) apl3510a/b, v in = 5v, t a =25 o c 0.0 0.5 1.0 1.5 2.0 2.5 3.0
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 7 - m a r . , 2 0 1 2 a p l 3 5 1 0 / 1 w w w . a n p e c . c o m . t w 9 o p e r a t i n g w a v e f o r m s t h e t e s t c o n d i t i o n i s v i n = 5 v , t a = 2 5 o c u n l e s s o t h e r w i s e s p e c i f i e d . t u r n o n r e s p o n s e t u r n o f f r e s p o n s e u v l o a t r i s i n g u v l o a t f a l l i n g 1 2 v enb v out 1 2 v enb v out 1 2 v in v out 1 2 v in v out ch1: v enb , 5v/div, dc time: 200 m s/div v in =5v, r load =30 w , c in =33 m f/electrolytic, c out =1 m f/electrolytic ch2: v out , 2v/div, dc time: 100 m s/div v in =5v, r load =30 w , c in =33 m f/electrolytic, c out =1 m f/electrolytic ch2: v out , 2v/div, dc ch1: v enb , 5v/div, dc time:2m s/div v in =5v, r load =30 w , c in =33 m f/electrolytic, c out =1 m f/electrolytic ch1: v in , 1v/div, dc ch2: v out , 1v/div, dc time:5m s/div ch2: v out , 1v/div, dc v in =5v, r load =30 w , c in =33 m f/electrolytic, c out =1 m f/electrolytic ch1: v in , 1v/div, dc
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 7 - m a r . , 2 0 1 2 a p l 3 5 1 0 / 1 w w w . a n p e c . c o m . t w 1 0 o p e r a t i n g w a v e f o r m s ( c o n t . ) t h e t e s t c o n d i t i o n i s v i n = 5 v , t a = 2 5 o c u n l e s s o t h e r w i s e s p e c i f i e d . o c b r e s p o n s e d u r i n g s h o r t c i r c u i t o c b r e s p o n s e d u r i n g o v e r l o a d o c b r e s p o n s e w i t h r a m p e d l o a d l o a d - t r a n s i e n t r e s p o n s e 1 2 3 v enb v ocb i out 1 2 v bat v chrin 3 v enb v ocb i out 2 1 v out i out ch1: v enb , 5v/div, dc ch2: v ocb , 5v/div, dc time: 5 m s/div v in =5v, r load =2 w , c in =c out =33 m f/ electrolytic ch3: i out , 1a/div, dc ch1: v enb , 5v/div, dc ch2: v ocb , 5v/div, dc time: 5 m s/div v in =5v, r load =0 w , c in =c out =33 m f/ electrolytic ch3: i out , 1a/div, dc ch1: v out , 5v/div, dc ch2: v ocb , 5v/div, dc time: 2 m s/div v in =5v, c in =c out =33 m f/electrolytic ch3: i out , 1a/div, dc 1 2 3 v ocb v out i out ch1: v out , 1v/div, dc time: 1 m s/div v in =5v, r load =1k w to 2.2 w , c in =c out =33 m f/ electrolytic ch2: i out , 1a/div, dc
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 7 - m a r . , 2 0 1 2 a p l 3 5 1 0 / 1 w w w . a n p e c . c o m . t w 1 1 p i n d e s c r i p t i o n pin no. sot - 23 - 5 sop - 8/ msop - 8 apl3510 apl3511 name function 1 2 2 gnd ground . 2 3 4 5 vin power supply input. c onnect this pin to external dc supply. en (a/c/e) enable input. pulling this pin to high will enable the device and pull ing this pin to low will disable device. the en pin cannot be left floating. 4 3 4 enb (b/d/f) enable input. pulling this pin to high will disable the device and pulling this pin to low will enable device. the enb pin cannot be left floating. 5 1 3 ocb faul t indication pin. this pin goes low when a current limit or an over - temperature condition is detected after a 12ms deglitch time. 6 7 8 5 1 vout output voltage pin. the output voltage follows the input voltage. when enb is high or en is low, the output voltag e is discharged by an internal resistor. b l o c k d i a g r a m gate driver and control logic uvlo vin vout charge pump ocb en/ enb otp gnd current limit short-circuit protection
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 7 - m a r . , 2 0 1 2 a p l 3 5 1 0 / 1 w w w . a n p e c . c o m . t w 1 2 t y p i c a l a p p l i c a t i o n c i r c u i t vin vout gnd apl3510a/b/c/d/e/f apl3511a/b/c/d ocb en/enb usb controller 5v 3.3v v bus d+ d- gnd usb port 50k w c in 1 m f c out 150 m f c byp 0.1 m f
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 7 - m a r . , 2 0 1 2 a p l 3 5 1 0 / 1 w w w . a n p e c . c o m . t w 1 3 f u n c t i o n d e s c r i p t i o n vin under-voltage lockout (uvlo) the apl3510/1 series of power switches have a built-in under-voltage lockout circuit to keep the output shutting off until internal circuitry is operating properly. the uvlo circuit has hysteresis and a de-glitch feature so that it will typically ignore undershoot transients on the input. when input voltage exceeds the uvlo threshold, the output voltage starts a soft-start to reduce the inrush current. power switch the power switch is an n-channel mosfet with a low r ds(on) . the internal power mosfet does not have the body diode. when ic is off, the mosfet prevents a cur- rent flowing from the vout back to vin and vin to vout. current-limit protection the apl3510/1 series of power switches provide the cur- rent-limit protection function. during current limit, the de- vices limit output current at current limit threshold. for reliable operation, the device should not be operated in current limit for extended period. short-circuit protection when the output voltage drops below v in -1v, which is caused by an over-load or a short-circuit, the devices limit the output current down to a safe level. the short-circuit current limit is used to reduce the power dissipation dur- ing short-circuit conditions. if the junction temperature reaches over-temperature threshold, the device will en- ter the thermal shutdown. ocb output the apl3510/1 series of power switches provide an open-drain output to indicate that a fault has occurred. when any of current-limit or over-temperature protection occurs for a deglitch time of t d(ocb) , the ocb goes low. since the ocb pin is an open-drain output, connecting a resistor to a pull high voltage is necessary. enable/disable pull the enb above 2v or en below 0.8v will disable the device, and pull enb pin below 0.8v or en above 2v will enable the device. when the ic is disabled, the supply current is reduced to less than 1 m a. the enable input is over-temperature protection when the junction temperature exceeds 140 o c, the inter- nal thermal sense circuit turns off the power fet and allows the device to cool down. when the device?s junc- tion temperature cools by 20 o c, the internal thermal sense circuit will enable the device, resulting in a pulsed output during continuous thermal protection. thermal protection is designed to protect the ic in the event of over temperature conditions. for normal operation, the junction temperature cannot exceed t j =+125 o c. compatible with both ttl and cmos logic levels. the en/enb pin cannot be left floating.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 7 - m a r . , 2 0 1 2 a p l 3 5 1 0 / 1 w w w . a n p e c . c o m . t w 1 4 a p p l i c a t i o n i n f o r m a t i o n i n p u t c a p a c i t o r a 1 m f c e r a m i c b y p a s s c a p a c i t o r f r o m v i n t o g n d , l o c a t e d n e a r t h e a p l 3 5 1 0 , i s s t r o n g l y r e c o m m e n d e d t o s u p p r e s s t h e r i n g i n g d u r i n g s h o r t c i r c u i t f a u l t e v e n t . w i t h o u t t h e b y p a s s c a p a c i t o r , t h e o u t p u t s h o r t m a y c a u s e s u f f i c i e n t r i n g i n g o n t h e i n p u t ( f r o m s u p p l y l e a d i n d u c t a n c e ) t o d a m - a g e i n t e r n a l c o n t r o l c i r c u i t r y . o u t p u t c a p a c i t o r a l o w - e s r 1 5 0 m f a l u m i n u m e l e c t r o l y t i c o r t a n t a l u m b e - t w e e n v o u t a n d g n d i s s t r o n g l y r e c o m m e n d e d t o r e d u c e t h e v o l t a g e d r o o p d u r i n g h o t - a t t a c h m e n t o f d o w n s t r e a m p e r i p h e r a l . ( p e r u s b 2 . 0 , o u t p u t p o r t s m u s t h a v e a m i n i - m u m 1 2 0 m f o f l o w - e s r b u l k c a p a c i t a n c e p e r h u b ) . h i g h e r - v a l u e o u t p u t c a p a c i t o r i s b e t t e r w h e n t h e o u t p u t l o a d i s h e a v y . a d d i t i o n a l l y , b y p a s s i n g t h e o u t p u t w i t h a 0 . 1 m f c e r a m i c c a p a c i t o r i m p r o v e s t h e i m m u n i t y o f t h e d e - v i c e t o s h o r t - c i r c u i t t r a n s i e n t s . layout consideration t h e p c b l a y o u t s h o u l d b e c a r e f u l l y p e r f o r m e d t o m a x i - m i z e t h e r m a l d i s s i p a t i o n a n d t o m i n i m i z e v o l t a g e d r o p , d r o o p a n d e m i . t h e f o l l o w i n g g u i d e l i n e s m u s t b e c o n s i d e r e d : 1 . p l e a s e p l a c e t h e i n p u t c a p a c i t o r s n e a r t h e v i n p i n a s c l o s e a s p o s s i b l e . 2 . o u t p u t d e c o u p l i n g c a p a c i t o r s f o r l o a d m u s t b e p l a c e d n e a r t h e l o a d a s c l o s e a s p o s s i b l e f o r d e c o u p l i n g h i g h - f r e q u e n c y r i p p l e s . 3 . l o c a t e a p l 3 5 1 0 a n d o u t p u t c a p a c i t o r s n e a r t h e l o a d t o r e d u c e p a r a s i t i c r e s i s t a n c e a n d i n d u c t a n c e f o r e x c e l - l e n t l o a d t r a n s i e n t p e r f o r m a n c e . 4 . t h e n e g a t i v e p i n s o f t h e i n p u t a n d o u t p u t c a p a c i t o r s a n d t h e g n d p i n m u s t b e c o n n e c t e d t o t h e g r o u n d p l a n e o f t h e l o a d . 5 . k e e p v i n a n d v o u t t r a c e s a s w i d e a n d s h o r t a s p o s s i b l e .
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 7 - m a r . , 2 0 1 2 a p l 3 5 1 0 / 1 w w w . a n p e c . c o m . t w 1 5 p a c k a g e i n f o r m a t i o n s o p - 8 d e e e 1 see view a c b h x 4 5 a a 1 a 2 l view a 0 . 2 5 seating plane gauge plane note: 1. follow jedec ms-012 aa. 2. dimension ? d ? does not include mold flash, protrusions or gate burrs. mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. dimension ? e ? does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 10 mil per side. s y m b o l min. max. 1.75 0.10 0.17 0.25 0.25 a a1 c d e e1 e h l millimeters b 0.31 0.51 sop-8 0.25 0.50 0.40 1.27 min. max. inches 0.069 0.004 0.012 0.020 0.007 0.010 0.010 0.020 0.016 0.050 0 0.010 1.27 bsc 0.050 bsc a2 1.25 0.049 0 8 0 8 3.80 5.80 4.80 4.00 6.20 5.00 0.189 0.197 0.228 0.244 0.150 0.157
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 7 - m a r . , 2 0 1 2 a p l 3 5 1 0 / 1 w w w . a n p e c . c o m . t w 1 6 p a c k a g e i n f o r m a t i o n m s o p - 8 a 0 l view a 0 . 2 5 gauge plane seating plane a 1 d e see view a e 1 e a 2 b c s y m b o l min. max. 1.10 0.00 0.22 0.38 0.08 0.23 0.15 a a1 b c d e e1 e l millimeters a2 0.75 0.95 0.65 bsc msop-8 0.40 0.80 0.026 bsc min. max. inches 0.043 0.000 0.030 0.037 0.009 0.015 0.003 0.009 0.016 0.031 0 0.006 0 8 0 8 4.70 5.10 2.90 3.10 2.90 3.10 0.114 0.122 0.185 0.201 0.114 0.122 note: 1. follow jedec mo-187 aa. 2. dimension ? d ? does not include mold flash, protrusions or gate burrs. mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. dimension ? e1 ? does not include inter-lead flash or protrusions. inter-lead flash and protrusions shall not exceed 5 mil per side.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 7 - m a r . , 2 0 1 2 a p l 3 5 1 0 / 1 w w w . a n p e c . c o m . t w 1 7 p a c k a g e i n f o r m a t i o n s o t - 2 3 - 5 max. 0.057 0.051 0.024 0.006 0.009 0.020 0.012 l 0.30 0 e e1 e1 e d c b 0.08 0.30 0.60 0.012 0.95 bsc 1.90 bsc 0.22 0.50 0.037 bsc 0.075 bsc 0.003 min. millimeters s y m b o l a1 a2 a 0.00 0.90 sot-23-5 max. 1.45 0.15 1.30 min. 0.000 0.035 inches 8 0 8 0 b c e1 0 l view a 0 . 2 5 gauge plane seating plane a a 2 a 1 e d e e 1 see view a 1.40 2.60 1.80 3.00 2.70 3.10 0.122 0.071 0.118 0.102 0.055 0.106 note : 1. follow jedec to-178 aa. 2. dimension d and e1 do not include mold flash, protrusions or gate burrs. mold flash, protrusion or gate burrs shall not exceed 10 mil per side.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 7 - m a r . , 2 0 1 2 a p l 3 5 1 0 / 1 w w w . a n p e c . c o m . t w 1 8 c a r r i e r t a p e & r e e l d i m e n s i o n s a e 1 a b w f t p0 od0 b a0 p2 k0 b 0 section b-b section a-a od1 p1 h t1 a d application a h t1 c d d w e1 f 330.0 ? 2.00 50 min. 12.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 12.0 ? 0.30 1.75 ? 0.10 5.5 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 sop - 8 4.0 ? 0.10 8.0 ? 0.10 2.0 ? 0.05 1.5+0.10 - 0.00 1.5 min. 0.6+0.00 - 0.40 6.40 ? 0.20 5.20 ? 0.20 2.10 ? 0.20 application a h t1 c d d w e1 f 330.0 ? 2.00 50 min. 12.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 12.0 ? 0.30 1.75 ? 0.10 5.5 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 msop - 8 4.00 ? 0.10 8.00 ? 0.10 2.00 ? 0.05 1.5+0. 10 - 0.00 1.5 min. 0.6+0.00 - 0.40 5.30 ? 0.20 3.30 ? 0.20 1.40 ? 0.20 application a h t1 c d d w e1 f 178.0 ? 2.00 50 min. 8.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 8.0 ? 0.30 1.75 ? 0.10 3.5 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 sot - 23 - 5 4.0 ? 0.10 4.0 ? 0.10 2.0 ? 0.05 1.5+0.10 - 0.00 1.0 min. 0.6+0.00 - 0.40 3.20 ? 0.20 3.10 ? 0.20 1.50 ? 0.20 (mm)
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 7 - m a r . , 2 0 1 2 a p l 3 5 1 0 / 1 w w w . a n p e c . c o m . t w 1 9 d e v i c e s p e r u n i t package type unit quantity sop - 8 tape & reel 2500 msop - 8 tape & reel 3000 sot - 23 - 5 tape & reel 3000 t a p i n g d i r e c t i o n i n f o r m a t i o n s o t - 2 3 - 5 s o p - 8 m s o p - 8 user direction of feed user direction of feed user direction of feed
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 7 - m a r . , 2 0 1 2 a p l 3 5 1 0 / 1 w w w . a n p e c . c o m . t w 2 0 c l a s s i f i c a t i o n r e f l o w p r o f i l e s profile feature sn - pb eutectic assembly pb - free assembly preheat & soak temperature min (t smin ) temperature max (t smax ) time (t smin to t smax ) ( t s ) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 1 2 0 seconds average ramp - up rate (t smax to t p ) 3 c/second ma x. 3 c/second max. liquidous temperature ( t l ) time at l iquidous (t l ) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak package body temperature (t p ) * see classification temp in table 1 see classification temp in table 2 time (t p ) ** within 5 c of the spec ified c lassification t emperature ( t c ) 2 0 ** seconds 3 0 ** seconds average r amp - down rate (t p to t smax ) 6 c/second max. 6 c/second max. time 25 c to p eak t emperature 6 minutes max. 8 minutes max. * tolerance for peak profile temperature (t p ) is defined a s a supplier minimum and a user maximum. ** tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. c l a s s i f i c a t i o n p r o f i l e
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 7 - m a r . , 2 0 1 2 a p l 3 5 1 0 / 1 w w w . a n p e c . c o m . t w 2 1 c l a s s i f i c a t i o n r e f l o w p r o f i l e s ( c o n t . ) c u s t o m e r s e r v i c e a n p e c e l e c t r o n i c s c o r p . head office : no.6, dusing 1st road, sbip, hsin-chu, taiwan, r.o.c. tel : 886-3-5642000 fax : 886-3-5642050 t a i p e i b r a n c h : 2 f , n o . 1 1 , l a n e 2 1 8 , s e c 2 j h o n g s i n g r d . , s i n d i a n c i t y , t a i p e i c o u n t y 2 3 1 4 6 , t a i w a n t e l : 8 8 6 - 2 - 2 9 1 0 - 3 8 3 8 f a x : 8 8 6 - 2 - 2 9 1 7 - 3 8 3 8 table 2. pb - free process ? classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 350 - 2000 volume mm 3 >2000 <1.6 mm 260 c 260 c 260 c 1.6 mm ? 2.5 mm 260 c 250 c 245 c 3 2.5 mm 250 c 245 c 245 c table 1. snpb eutectic process ? classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 3 350 <2.5 mm 235 c 22 0 c 3 2.5 mm 220 c 220 c test item method description solderability jesd - 22, b102 5 sec, 245 c holt jesd - 22, a108 1000 hrs, bias @ tj=125 c pct jesd - 22, a102 168 hrs, 100 % rh, 2atm , 121 c tct jesd - 22, a104 500 cycles, - 65 c~150 c hbm mil - std - 883 - 3015.7 vhbm ? 2kv mm jesd - 22, a1 15 vmm ? 200v latch - up jesd 78 10ms, 1 tr ? 100ma r e l i a b i l i t y t e s t p r o g r a m

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